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LM317: Do you have any thermal information of LM317KTT(TO-263) with 2 layers PCB?

Kazuya Nakai59
Guru 21505 points
Part Number: LM317

 Hello guys,

 One of our customers wants to know any thermal information of LM317KTT(TO-263) when two layers PCB board (not 2s2p) is used for the device.

 Do you have any data. If yes, could you please send me it? 

 Your reply would be much appreciated.

 Best regards,

 Kazuya Nakai.

  • 0
    Guru 140200 points
    Hi Kazuya,

    what di you mean by "two layers PCB board (not 2s2p)"?

    Kai
  • 0 in reply to kai klaas69
    TI__Guru 55940 points
    Hi Kazuya,

    In general we only use the JEDEC 2s2p board for our thermal measurements and simulations. Section 1.2 of the following Application Report can help give some estimate of how a particular test card can impact the thermal metrics presented. It is important to note that the information provided in the thermal information tables of a datasheet is meant as a way to compare two devices. The Application Report below shows how TI makes these measurements in a standardized way; however, these standardized methods do not always directly translate into a real application using the device. The primary heatsink for LM317 is the OUTPUT plane. The more copper directly attached to the OUTPUT tab of the LDO, the more heat can be pulled out of the LDO.

    www.ti.com/.../spra953c.pdf

    Very Respectfully,
    Ryan
  • 0 in reply to Ryan Eslinger
    Guru 21505 points
    Hi Ryan and Kai

    Thank you very much for your reply. Your explanation and the application note are very helpful for my customer and me.

    Thank you again and best regards,
    Kazuya Nakai.