For the LMZ31530 component, I am investigating how tall it will be when the soldering is applied to it. I see the part ranges between 5.70-5.90 mm before the solder is applied, but it also appears that there are cut-outs where the solder would be applied on the bottom. I am unsure exactly how deep these cutouts are as there are three dimensions which look like they might be relating to this height (0.05, 0.08, and 0.20). It also appears that these cutouts have widths of 0.40 +/- 0.09 mm which would lead me to assume that the solder balls would have a diameter of 0.40 mm. Any clarification on how to approximate the total height of the component with the solder balls would be greatly appreciated (such adding the solder balls' diameter to the height of the component and then subtracting the cut out depth). In order to do this, clarity to the suggested solder balls' dimensions as well as to which cut out depth is used would be necessary.
Thank you very much,
Trevor Garlinghouse
