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TPS7A49: DGN Package Thermal Via Sizing

Evan Cornell
Expert 1410 points
Part Number: TPS7A49
Other Parts Discussed in Thread: TPS7A30

I know from TPS7A49 / TPS7A30 datasheet that TI DGN package is supposed to have 0.2mm (8mil) diameter thermal via. However, with some PCB manufacturers, 0.3mm (~12mil) hole size yields much more cost effective PCB. 

I also see that DRB package option has 0.3mm diameter thermal via specification.

Question: is it acceptable to use 0.3mm diameter thermal via with TI DGN package? Any adverse effects?

  • 0
    TI__Expert 7025 points
    Hi Evan,

    I don't think there will be any problem using a different diameter thermal via.

    The only adverse effects I could see are bigger holes can wick more solder from the pad causing it not to make as good of a connection and making thermal performance worse. It may also get worse thermal performance only using a few large holes instead of a lot of little holes. Most of the benefit comes from having a lot of different paths to other layers to dissipate heat.

    Best Regards,
    Mark
  • 0
    Guru 140200 points
    Hi Evan,

    I agree with Mark, 0.3mm diameter thermal vias are fully acceptable. I also use them.

    Kai