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BQ24610: Bq24610 charging current is lower than my setting

Part Number: BQ24610
Other Parts Discussed in Thread: BQ24650

Dear Expert, I measure my charging current. It is smaller than my setting. Such as if I set the charging current equal to 900mA, I measure the charging current is about 850mA on TI EVB board. But I measure my PCB board, It is about 780mA(average current on oscilloscope, it's maximum current is about 900mA). What's the root cause? My sense resistor is10 mΩ, the same with TI EVB. Whether I should increase the value of sense resistor? Another issue is the heat of bq24610. When the battery is charging, the bq24610 will heat, but charging can be proceed. Below is my PCB layout, the red block is bq24610, it is mounted on PCB's bottom layer. My PCB is 4-layer. the bq24610's thermal PAD is assigned to AGND on the PCB's second layer(Blue region). The AGND is connected to the PGND via the 0805 0Ω resistor(yellow block). Whether my AGND's area is too smaller to spread out the bq24610's heat? The Taiwan FAE tell me, the heat just will happen on external MOSFET, the bq24610 just is a switching controller and will not be heated. Is this right? Thanks.

  • The bq24610 is only a controller. The main power dissipation should be on the external switching FETs not the bq24650.

    Can you show a scope capture of your charge current? Where is the current sense resistor placed on your board? How is it connected to the IC? Kelvin sense should be used on SRN and SRP traces. 

  • Jason,
    The voltage on the sensing resistor is less than 10 mV. It can be estimated that the accuracy of the charging current of your case is about 10%-15% based on the 20mV and 4mV accuracy shown on datasheet Page 7. If you want to increase the accuracy of the charging current, increasing the sensing resistor value is the option.
    bq25610 is a charger controller with MOSFET driver. The power dissipation from the driver generates heats. Please refer to Page 29 of the datasheet. Enough PCB copper-pour area on different layers is needed to ensure the thermal dissipation.
    Regards,
    Eric