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TPS54162-Q1: Require Junction to Case Thermal Resistance when Pad not soldered on PCB

Praveen GD
Guru 57737 points
Part Number: TPS54162-Q1

HI Team,

TPS54162Q1 has  20-Pin HTSSOP PowerPAD™ package .It is having exposed thermal pad and its junction to case thermal resistance is provided as 10 °C/W in datasheet.

Is this value considering that the pad is soldered to PCB ?

What would be thermal resistance if the thermal pad is not  soldered to PCB?

Regards,

Praveen GD

  • 0
    TI__Mastermind 23845 points
    Hi,

    I would use the values from
    www.ti.com/.../tps54262-q1.pdf

    Since they are the same family of parts

    Thanks
  • 0
    TI__Genius 11085 points
    The 10 °C/W is from junction to exposed pad, it doesn't matter pad is soldered to board or not. That just means how efficiency heat transfer from junction to pad. To estimate temperature rise from ambient temperature to junction temperature, please use Theta JA, which is 35 °C/W. This is with pad soldered to pcb ground.

    If the exposed pad is not soldered to ground on the PCB, the Theta JA number will be much higher. The pad is designed to dissipate the majority of heat. It is designed to be soldered to the PCB. TI does not recommend not soldering the pad to the
    PCB due to the risk of worse thermal performance and mechanical integrity.

    -Yang