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BQ24105-Q1: "Example Board Layout" and "Example Stencil Design"

K.Yaita
Guru 29720 points
Part Number: BQ24105-Q1

Hi Team,

My customer has bq24105-Q1 datasheet and it shows "Example Board Layout" and "Example Stencil Design" as the following.
These are different from current datasheet in web.



1)
Could you tell me the background of updating?

2)
Is there any concern if my customer designed with their datasheet (above)?

Best Regards,
Yaita / Japan disty

  • 0
    TI__Expert 8690 points

    Hi Yaita,

    I am checking with the packaging team and will get back to you.

    Can you also share the datasheet they have?


    Regards,
    Steven

  • 0 in reply to Steven Bangdiwala
    Guru 29720 points

    bq24105-q1.pdf

    Thank you for your support.
    I attached the datasheet thy have.

    Best Regards,
    Yaita

  • 0 in reply to K.Yaita
    Guru 29720 points

    Hi Steven-san,

    My customer is currently designing their board and wants to know the following as soon as possible.
    >Is there any concern if my customer designed with their datasheet (above)?

    Could you support it until a few days?

    Best Regards,
    Yaita

  • 0 in reply to K.Yaita
    TI__Expert 8690 points
    Hi Yaita-san,

    There is concern over the solder paste filling the vias that are on the layout, which is why in the new guidelines, the vias are not covered by solder paste.

    There are two approaches for this:
    1. Keep the same guidelines as before, but be sure that the board fab fills the vias, that way the solder paste stays in place.
    2. Change the layout and stencils with the new guidelines, which will prevent the vias from filling with solder paste.

    The less design intense approach is #1, you can keep the same guidelines, but make sure the vias are filled before applying the solder paste.

    Regards,
    Steven