LMR33630: Thermal Performance in Different Packages

Allan Fan

Part Number: LMR33630

Team,

Checked LMR33630 thermal information, it looks HSOIC with thermal pad is better than QFN package but wondering why the simulation result shows in contrary?

24Vin to 6Vout/3A SOIC package

24Vin to 6Vout/3A WSON package

Thanks.

Allan

over 7 years ago

0 Brani Dubocanin over 7 years ago

TI__Expert 4100 points

Hello Allan,
I will move this question to Webench forum.
Regards
Brani

0 Allan Fan over 7 years ago in reply to Brani Dubocanin

TI__Expert 7090 points

Hi Brani,
Before Webench team confirm simulation result, I would like to know the SOIC package should have better thermal performance, correct?
Thanks,
Allan

0 Brani Dubocanin over 7 years ago in reply to Allan Fan

TI__Expert 4100 points

Hi Allan,
Yes, that is correct.
The reason for better thermal performance is due to the fact that SOIC package has thermal pad where QFN package does not.
Regards
Brani

Power management

Power management forum

LMR33630: Thermal Performance in Different Packages