Hi team,
I am working on a design with TPS55340. I am wondering what is the best way to measure the IC junction temperature to ensure that I am staying within the 150C spec of the device. I understand the measurement should be taken at normal operation, but I am curious to know if there are any recommended instruments or methodologies for this measurement.
For the sake of context, my normal conditions are 6-10Vin, 26Vout, ~700mA out.
Thanks!
Brian Angiel
Different layout will have different thermal perfomance. so layout is a key point for the thermal. So firstly, please refer to the TPS55340 EVM and datasheet for the pcb layout.
Suggest you use a 4-layer board to get good thermal performance.
The best way to measure thermal is using juncttion-to-top characteristic. So you need to test the thermal on the TPS55340's top, Tj=Ttop+0.4*Ploss. For the TPS55340 Ttop and the Tj is very close if the loss is not big. Ttop is determined by the layout.
By the way, coulld you please share the end equipment with us?
