• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 63 subscribers
  • Views 469 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

CSD95372BQ5M: Thermal/Mechanical Information

FRA51029
Prodigy 80 points
Part Number: CSD95372BQ5M

Hello,

Could you provide me the following data concerning the CSD95372BQ5M :

- Theta_JC_top (Junction to Case thermal resistance with heat flow through package top);

- Theta_JC_bot (Junction to Case thermal resistance with heat flow through package bottom);

- Minimum and maximum height after reflow ?

Best regards

  • 0
    TI__Mastermind 18200 points
    Fred,
    Thanks for posting on our forum. The thermal information you are asking for is provided in the thermal information table on page 4 of the datasheet:

    www.ti.com/.../csd95372bq5m.pdf

    But the max RthJC_Top is 15degC/W and RthJC_Bot is 1.5degC/W.

    The min and max spec for profile height are given as dimension A in the mechanical information section (page 7).

    Typical value is 1.45mm, min is 1.4mm, max is 1.5mm. I confirmed with our packaging engineers that those tolerances are dictated by the mold compound surrounding the device, and should not change under reflow.