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UC2825: UC2825DW Thermal parameters

Masazumi Ishii
Genius 3945 points
Part Number: UC2825

Hello.

I have a question about UCC 2825 DW.
I want to obtain the junction temperature from the IC body temperature and power consumption.
I think that there is a method to obtain by the parameter of Ψjt.
What is Ψjt?

When junction temperature is high, please tell me effective heat dissipation method.

thank you.

  • 0
    TI__Mastermind 31580 points
    Hi Masazumi-san,

    The junction board thermal impedance is 30.8C per W for the SOIC 16 pin DW package. If you know the power consumption then multiple the power by 30.8C to get the junction temperature rise above the PCB/pin temperature of the IC.

    Best way of cooling is by heatsinking into the copper on the PCB. There are small heatsinks that you can stick to the top of the package which can help if there is forced air cooling in the system.

    Alternatively an external gate drive IC can be added to reduce the gate drive power consumption which will lower the junction temperature.

    Regards

    Peter
  • 0 in reply to Peter Meaney
    Genius 3945 points

    Hello

    thank you for your answer.
    Sorry about the basic question.

    θjb = 30.8 ° C / W
    Is that it?

    It is meant to measure the IC's PCB / PIN temperature, but the SOIC 16 pin DW package has 16 pins. Which pins can be measured?

    Thank you.

  • 0 in reply to Masazumi Ishii
    TI__Mastermind 31580 points
    Hi Masazumi-san

    The Pins and PCB will all the at the same temperature as the area is small so I would measure the ground pin temperature or the copper trace temperature close to the ground pin.

    Regards

    Peter