Because of the holidays, TI E2E™ design support forum responses will be delayed from Dec. 25 through Jan. 2. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS53353: Junction-to-top characterization parameter, ψJT

Part Number: TPS53353

Hi sirs,

 

From the application report page 8, http://www.ti.com/lit/an/spra953c/spra953c.pdf

We learned ΨJT varies with both board construction and air flow conditions as shown in Table 3. The values in Table 3 were obtained through modeling.

However, what are the conditions of PCB type and air flow that we got the thermal metric shown in TPS53353 datasheet? Thanks!

 From the application report page 9:

 

TPS53353 Thermal Metric from datasheet page 5:

 

Best regards,

Sam Ting