Hi,
Does this part has a thermal PAD? In Datasheet it is not shown in Footprint as well as in schematic symbol, please clarify.
I want to calculate the Cu area for dissipating the power of 0.84W from this IC.
As per datasheet RθJA Junction-to-ambient thermal resistance is 130.8 c/w and Tj max is 150C
Temperature rise= θJA* Pd
=130.8 c/w*0.84w
=109.872 C
Assume my ambient temperature is 40C
Then T total= Tamb+Trise
=149.87
Head room left over Junction temperature is 150C-149.87C = 0.13C (Tjmax - Ttotal).
Datasheet mentions max current for charging is 1.25A. Please let me know what is the condition required to handle 1.25A ( if thermal PAD needs to be provided what is its area)
Thanks
Navaneeth
