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TPS23754: Thermal pad to power ground

na na78
Guru 16770 points
Part Number: TPS23754

Hi

Is it OK to connect PowerPad to PGND on the other layer with through-hole for heat dissipation?

We don't use ethernet input but adapter input is used.  Only PGND has large pattern.

BestRegards

  • 0
    TI__Mastermind 41790 points

    Hi na na78,

    The dissipation is mainly for the internal pass FET of the PD controller (from PoE). Since Ethernet input is not used the pass FET is not dissipating but it doesn't hurt to connect the pad to a plane of copper for some extra mechanical stability. However, I would put it on a floating plane and not PGND since if not designed correctly, the adapter on VDD-RTN, with VSS and RTN shorted will place a voltage on VDD-VSS and might turn on circuitry on the PoE (VSS) side.

    Regards,

    Darwin