This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS7B63-Q1: PACKAGE OUTLINE

Part Number: TPS7B63-Q1

Hi all,

In the upper left of P.15 of TPS7B63-Q1 's datasheet, it is described as PWP0016J.

Looking at other IC data sheets of the same package type (HTSSOP), there are PWP0016A, PWP0016D, etc.

These differences seem to be the size of THERMAL PAD.

Why are you changing the THERMAL PAD size with the same package type?

Best Regards,
Koji Hayashi