Greetings,
is there any reason why the VIN, VOUT, PGND & AGND Planes are duplicated on 3 layers in the layout guideline?
Are they only used for thermal dissipation?
Thank you
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Greetings,
is there any reason why the VIN, VOUT, PGND & AGND Planes are duplicated on 3 layers in the layout guideline?
Are they only used for thermal dissipation?
Thank you