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TLV713: Capacitors choice and Layout for Thermal dissipation

Adrian Ymeraj
Expert 3810 points
Part Number: TLV713

Hi all,

reading the datasheet of the TLV713 the curve representing Vout compared to Iout and Vin show a couple of values for the capacitors to be used.

In order to smooth out the peaks on the Vout trace, do you have any recommendation for the values of the capacitors?

Do we have any application note or report that describe the best way on how to chose Cin and Cout?

Furthermore, on page 20 you can see the curve for the power dissipation, which are obtained using the JEDEC Standard, High K layout with no airflow; is the layout showed on pictures 30 and 31 the same as the JEDEC Standard? Or are those layouts showed just as an example not correspondent to the JEDEC Standard?

Thanks in advance.

Regards,

Adrian

  • 0
    TI__Guru 55940 points

    Hi Adrian,

    Capacitor selection will vary by application.  As such it is industry standard to only specify the corner requirements to maintain stability.  TLV713 can achieve stability without any capacitors; however, ac performance such as transient response can be improved with the addition of input and output capacitors.  Additional capacitance will reduce the magnitude of the transient response; however, it will increase the response time.  The best way to select capacitors for a given application is to build a prototype of your application and perform transient tests while monitoring the output.  While it is best to use the actual application board since layout does play a role in ac performance, evaluation boards such as TLV71318PEVM-171 can be used to help select the best capacitors for your specific application.

    The Layout Examples provided in the datasheet are not JEDEC High K boards.  The JEDEC High K board is used solely for the purpose of a standardized layout for comparing thermal performance.  It is not a realistic layout for an actual application.  The Layout Examples visualizations shown follow best practice layout techniques for the TLV713.  Following these layout techniques can yield better thermal performance than the JEDEC High K board as they maximize top layer copper.  The primary heatsink for the TLV713 is the GND plane.  As such maximizing the size of the GND plane will yield the best thermal performance.

    Very Respectfully,

    Ryan