• State Resolved
  • Locked Locked
  • Replies 3 replies
  • Subscribers 64 subscribers
  • Views 584 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

UCC27712: Adding heat sink / radiator for better heat dissipation

Bart
Expert 6370 points
Part Number: UCC27712

Team,

in the user guide for UCC27712 we mention using heat sink for better thermal performance.

What is the advised type of heat sink or radiator to lower the operating temperature of UCC27712 under high load?

Thanks for your help.

  • 0
    TI__Mastermind 21935 points
    Hello Bartosz,
    I am an application engineer with TI supporting the UCC27712 driver and will work to address your questions.
    The users guide suggests adding heatsinks to the MOSFETs to lower the operating temperature of the MOSFETs. The EVM includes the pattern for a TO-220 power device so the MOSFETs on the EVM can be removed and replaced with the equivalent parts in the TO-220 package which is the IPP65R190CFD.
    There are a number of standard heatsinks compatible with TO-220 transistors but the width should be limited to ~0.6" or less to avoid heatsinks contacting each other.
    Some examples of heatsinks that can be used from Aavid are: 577102B00000G, 577202B00000G and 576802B00000G.

    Please confirm on the thread if this answers your questions.

    Regards,
    Richard Herring
  • 0 in reply to Richard Herring
    TI__Expert 6370 points

    Hi Richard,

    thanks for your feedback. We were looking into applying a heatsink/radiator specifically onto the driver itself. Do you have some experience with that?

    Thank you.

  • 0 in reply to Bart
    TI__Mastermind 21935 points

    Hello Bartosz,

    Regarding adding a heatsink for the IC itself. I have not implemented this any in previous production board designs during hardware design positions.

    I did some searching and I see Fischer Elektronik offers some small extrusion designs targeted for DIP and SMD applications. One example part number is ICK SMD A 8 SA. Regarding attachment to the driver IC, there are thermally conductive epoxies and I see that 3M makes a thermally conductive tape.

    I would be careful that the heatsink does not come into close proximity of pins 5 thu 8 on the IC, if there is a high voltage input to the converter. There is possibly high voltage potential from pin 5 to pins 6 thru 8 on the driver IC.

    I hope this helps.

    Regards

    Richard Herring