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LMG1020: Assembling the LMG1020 DSBGA package without additional solder paste

Martins89
Prodigy 15 points
Part Number: LMG1020
Other Parts Discussed in Thread: UCC27611

Hello,

we'd like to assemle the LMG1020 on a PCB where the manufacturing process unfortunately can't achieve precise enough solder stop mask openings that are feasable for SMD / NSMD pad design.

If we only apply tacky no-clean flux and no additional solder paste, would the solder volume applied to the part as delivered from TI be sufficient to create a reliable solder joint?

We were thinking about this aproach because when using solder paste we might take the risk of short circuits between the balls due to the lack of solder stop separation between the balls.

Thanks in advance.

Kind regards,

Martin

  • 0
    TI__Guru**** 189401 points
    Hi Martin,

    Unfortunately, we can't recommend this. Our part is designed to be used with a thin layer of solder paste on the PCB.

    You might consider the UCC27611. It is available in a larger package which might be more compatible with your PCB process.