TI use capacitive isolation method for isolation gate drive IC
is there any study about EMI issue caused by the capacitor between high side and low side?
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TI use capacitive isolation method for isolation gate drive IC
is there any study about EMI issue caused by the capacitor between high side and low side?
Hi Albert,
I have not found any specific study done with regards to any potential EMI between high and low side channels.
Depending on your system/application needs, consider taking a look at UCC21225A a dual-channel isolated gate driver, which uses a functional isolation barrier between high and low side and allowing working working voltage up to 700-VDC between the 2 secondary sides drivers meeting industry safety certifications.
This functional isolation barrier is based through a series of circuits etched in silicon. Its center is a silicon dioxide-fabricated capacitor allowing to block direct current flow by leveraging an edge-based detection scheme.
The link below discusses some of the tests/studies done on our isolation technology.
Please let us know if you need further assistance or press the green button if this helped addressed your concern.
Thanks.
Regards,
-Mamadou