BQ51050B: Macromelt process

Gerardo L

Part Number: BQ51050B

Dear Sir or Madam,

We want to protect our PCB custom design with Macromelt from Henkel in order to avoid water. Please, find attached the information about this process.

About that, I have a couple of questions:

1 - Is the BQ51050B able to resist the a pressure of between 5 and 40 bars, and 180º and 240º degrees of temperature during 2 seconds?

2 - How this material can affect to the wireless charge?

Thank you so much in advance,
Gerardo

henkel-presentation-technomelt-formerly-branded-as-macromelt-molding.pdf

over 6 years ago

0 Bill Johns over 6 years ago

TI__Guru* 75656 points

Hello
The BQ51050B is available in two packages, YFP - Ball Grid Array and RHL - QFN. Which is planned for your design?

0 Gerardo L over 6 years ago in reply to Bill Johns

Prodigy 170 points

Hi Bill,

The one I used is RHL-QFN model.

Best regards,
Gerardo

0 Bill Johns over 6 years ago in reply to Gerardo L

TI__Guru* 75656 points

Hi Gerardo
The QFN package will present less problem, solder joints are more robust and solder pad of QFN reduces uplift force of material. The high temp of 240C is below solder re-flow point that the device is designed for.
Beyond that if the process is designed for electronics components you should be OK.
The RX coil may need some closer study also.

Power management

Power management forum

BQ51050B: Macromelt process