• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 63 subscribers
  • Views 466 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMZM23601: For inverting applications should the thermal pad be left floating?

Jason Galtieri
Intellectual 400 points
Part Number: LMZM23601

In the datasheet the thermal pad is said to be internally connected to GND. However in the inverting application we treat swap GND pins with Vout pins to get the negative output. With that being said the thermal pad should now be connected internally to Vout, in which case the thermal pad should not be connected to the ground plane on the PCB layout (correct?). Will there be thermal issues then if the thermal pad is left floating or is connected to the smaller Vout plane? Apologies if i missed anything in the inverting application document, but I didn't see any discussion of what to do with the thermal plane in there.

Thanks
Jason

  • 0
    TI__Guru 50120 points

    Hi Jason,

    The thermal pad on the configured LMZM23601 is now designated as nVout. To pour the planes, it would look something like this below:

    The device used is a converter so you will see an inductor L1 in the image. Here you can see that the four pads(used to be GND) is connected to the smaller -Vout plane. This image was taken from the linked blog. Hope this helps illustrate what the PCB layout would look like. 

    Regards,

    Jimmy