Application brief SLMA004B states, "Solder mask should be applied to cover the entire bottom side of the PowerPAD vias to prevent solder wicking. This includes full solder mask coverage over the vias." Our board house as expressed concern over possible outgassing due to the vias being open an covered by paste on the top and closed by solder mask on the bottom. Is this truly a concern or should we tell the board house to follow TI's instructions?
Thanks,
TL
