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LMZ21700: Why the package of the LMZ has changed?

Romain Gloo
Prodigy 70 points
Part Number: LMZ21700

Hello,

The LMZ21700 datasheet talks about the uSiP package. With this package, the inductor is clearly visible on top of the component. It seems to be the only package available.

However, we ordered some samples at a time where they were not available at Digikey. The samples we have have a different package with a plastic enclosure making the inductor unvisible. And a few ago, we received PCB assembly from China with the package described in the datasheet.

Maybe a TI's employee can explain why the package has changed? 

Any information will be appreciated!

Thank you and have a nice day

R

  • 0
    TI__Guru 50120 points

    Hi Romain,

    Did you order the samples recently from TI store when Digikey did not have these available? Initially the LMZ21700 had early engineering samples in QFN (enclosed inductor) package but did not RTM because of package quality concerns. Because of this, the LMZ21700 was redesigned and package into a uSIP (nano) footprint. It sounds like you might have samples of LMZ21700 that date back to at least 2012 when the device was released. Can you confirm when the samples were obtained and also provide a picture for reference?

    Regards,

    Jimmy 

  • 0 in reply to Jimmy Hua
    Prodigy 70 points

    Hi Jimmy,

    Thank you for your message.  Here is a picture showing what our first LMZ21700 looks like. It comes from Digikey and was ordered in 2017. It is a QFN package. So it seems that we have old components coming from another era. The device code is readable (PZ21700, 00A1, P1 WD). Is it possible to retrieve the production date with this code ?

    But if you say that the new package is better regarding the quality, that's fine!

    Thank you very much and have a nice day. 

  • 0 in reply to Romain Gloo
    TI__Guru 50120 points

    Hi Romain,

    That definitely looks like an older part with QFN package. I'd need to run this by the customer quality engineer to pull up the specific decoding of the data code and reply back to you when I get the information. The new and improved nano package(uSIP) is what we currently promote as the package for the LMZ21700. 

    Please let me know if there are any further questions. 

    Regards,
    Jimmy

  • 0 in reply to Jimmy Hua
    Prodigy 70 points

    Hi Jimmy,

    Thank you for your answer. It is clearer for us now. 

    We wait for your feedback about the date code. 

    Regards,

    Romain

  • 0 in reply to Romain Gloo
    TI__Guru 50120 points
    Hi Romain,

    Sorry for the late reply. This is definitely engineering samples that predate the existing finalized LMZ21700 package. Just wanted to be clear that this was never released as an option for during production. This molded package was most likely started around 2011.

    Regards,
    Jimmy