We have two TPS54360 circuit.
36Vin, 24Vout, 3A
36Vin, 16Vout, 3A
About circuit external components value, please refer to the below WEBENCH file.
Layout pattern is almost the same.
From WEBENCH result, I think temperature rise becomes almost same level between 24Vout board and 16Vout board.
However it was different on actual board.
At 24Vout board, package temperature rise was about 40 degC. At 16Vout board, it was 50 degC. we cannot understand why temperature rise of 16Vout board become larger than 24Vout board.
Do you have any idea for this cause? Variation of thermal resistance?
Best Regards,
Kohei Sasaki
