This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS62097-Q1: Question about package and recommended reflow profile

Part Number: TPS62097-Q1
Other Parts Discussed in Thread: TPS62097

Hi Champs,

Q.1) My customer required recommended reflow profile of TPS62097QWRGTRQ1, could you provide it?

Q.2) Below shows cross-sectional view of wettable-frank package pin. The red line (=bottom surface) is Sn-plated, but how about blue lined surface, yellow lined surface, and green lined surface? Are those surface also Sn-plated? 

Best regards,

  • Hi Nobuo,

    I don't think this package requires any specific reflow profile. I think it can be soldered like any other QFN package. In my experience reflow profiles are more dependent on specifics of the manufacturing line, the PCB design and the solder which is used.
    As I understand the process of how the wettable flanks are generated everything on the pad except the side which you marked in green has appropriate plating like for example Sn or NiPdAu.

    Best regards,
  • Hi Juergen,

    Regarding to reflow profile, can we say that description in 5.2 Solder Reflow of "" would also work for TPS62097 3x3 wettable frank package?

    Best regards,

    Nobuo Fujihara

  • This application note gives guidelines for defining a reflow profile to solder a QFN package. Of course this is valid for a QFN package with wettable flanks as well. I thought I mentioned this already in my answer above ..