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CSD95482RWJ: Junction to Ambient Thermal Resistance θJA(℃/W)

Shu-Cheng LIN
Guru 11785 points
Part Number: CSD95482RWJ

Hi Sirs,

Sorry to bother you.

Please share CSD95482RWJ  θJA(℃/W) information for us. Thanks!!

  • 0
    TI__Mastermind 24075 points
    Hi Shu-cheng,

    We will have someone to reply to you.

    Thanks
    Qian
  • 0 in reply to Qian Chen
    TI__Prodigy 510 points

    Hi Shu-cheng,

    Thanks for your interest in the CSD95482RWJ.  

    We do not publish θJA for this device since it is very subjective to customer board and thermal design.  However, please see below for thermal information related to this device.

    THERMAL METRIC   TYP UNIT
    θJC Thermal resistance, junction-to-case (top of package) 8.2 °C/W
    θJB Thermal resistance, junction-to-board(1) 2.2 °C/W
    ΨJT Junction-to-top characterization parameter  1.0 °C/W

      
      
     

    (1)  θJB is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in, 0.06-in (1.52-mm)
    thick FR4 board based on hottest board temperature within 1 mm of the package.

    Best Regards,

    Evan

  • 0
    TI__Intellectual 800 points

    Hi Shu-Cheng,

    Thermal resistance θJA measured in (℃/W) is not a parameter solely defined by CSD95482RWJ power stage, but by the PCB layout and System where the part is used.

    Thermal resistance J-A is the sum of two resistances: junction-to-board and Board-to-ambient.

    The first thermal resistance junction-to-board is 2.2℃/W for CSD95482RWJ, when mounted on a 1sq2 single layer PCB.

    The second thermal resistance Board-to-ambient is defined by your System design such as PCB number of layers and copper thickness.

    You need to find this value based on your System design where Power dissipation is function of switching conditions you  use.

    Best regards.