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TLC6C5912: Ground pad for footprint?

Lee McCrocklin56
Prodigy 10 points
Part Number: TLC6C5912

Section 11 of the TLC6C5912 datasheet shows a Layout Example with a large GND fill area under the device, but pin 20 is the only GND pin. Normally a large pour under the chip means there is a GND pad on the bottom of the package, but the package diagrams on pages 21-22 do not show a bottom pad.

Is the Junction-to-board Thermal Resistance just through pin 20?

Thanks,

Lee

  • 0
    TI__Expert 3190 points
    Hi Lee,
    Yes, you are right. Pin 20 is the only GND pin.
    The effective way to control the temperature is to expedite thermal spreading from cooper to ambient air. That is the reason to maximum the cooper coverage.
    And theoretically, the pin and the cooper that connected to the pin will have the same temperature because of the good thermal conductivity of the metal. one pin is enough for this package.

    Regards,
    Shawn.