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TPS53355: Compound Void issue

Brian Tsoi
Prodigy 150 points
Part Number: TPS53355

There are suspected compound void that we need to clarify are these ok or not.
The void area is pretty large, and we cannot sure is that void located at compound or just the die attached void.
Please help to clarify are these void acceptable.

And will these void have any impact for the function?

  • 0
    TI__Intellectual 2460 points
    Hello Brian,
    I am not quite sure the question address to. Every production IC has to go the functional tests and meet the test program limit before shipping to the customers.
    If you have concern or issue with the IC, please work with the local support team to send the part back for failure analysis process.
    Kit