• State TI Thinks Resolved
  • Locked Locked
  • Replies 6 replies
  • Answers 3 answers
  • Subscribers 64 subscribers
  • Views 588 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Original question:

TPS53355: LSON 22 package Mold compound/die attach void

TPS53355: Die Attach void guideline

Adrian B
Prodigy 130 points

Part Number: TPS53355

Dear TI,

do you have any guideline or description about Die attach void acceptance criteria?

thanks

Adrian Boszormenyi

  • 0
    TI__Intellectual 2460 points

    Hello Adrian,

    Can you please be more specific to your question? Is your question regarding internal die attach to the package? If yes, we need to reach out the package team. However, please expect delay response due to the holiday coming week.

    If your question regarding to the package information, the datasheet has this section.

    Kit

  • 0 in reply to Henry Nguyen
    TI__Intellectual 1520 points
    Hi Adrian,
    Sue has answer you on the other thread. I will close this one.

    "I checked with our package expert and here is his response .
    Single largest void on any layer cannot be greater than 5% of the die area. Cumulative size of all voids on any one layer cannot be greater than 20% of the die size.
    With this criteria, this is a good device. We don’t expect any functional issues."


    Thank you.
    Amnat
  • 0 in reply to Newey Yakamna
    Prodigy 130 points
    hi Kit,

    yes, I received the answer for the void issue, but my question was is there any official TI guideline about the die attach mold void acceptance for different packages? for example illustrated with examples.

    thank you very much for your support!

    REgards,
    ADrian
  • 0 in reply to Adrian B
    TI__Intellectual 2460 points

    Hi Adrian,

    To help address different package other than  TPS53355, please post the question with part number which relates to that part package.  Each part might assign to different team to get the supports. 

    Kit

  • 0 in reply to Henry Nguyen
    Prodigy 130 points

    HI Kit,

    Let's stay then at TPS53355. this part number has LSON-CLIP (22) package. my question would be is there any published document about the die attach mold void? some kind of description about what is the accepted level , which size of void should be rejected etc etc. 

    thanks

    Adrian

  • 0 in reply to Adrian B
    TI__Intellectual 2460 points
    Hi Adrian,
    Newey responded to the question above. Please see his comments below again. More likely, there is no document on this topic.

    Hi Adrian,
    Sue has answer you on the other thread. I will close this one.

    "I checked with our package expert and here is his response .
    Single largest void on any layer cannot be greater than 5% of the die area. Cumulative size of all voids on any one layer cannot be greater than 20% of the die size.
    With this criteria, this is a good device. We don’t expect any functional issues."