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TPS22990: Exposed Pad Connection

Don Schelle
Expert 4150 points
Part Number: TPS22990

Hello,

A customer of mine accidentally connected the EP the GND (vs VIN as the datasheet would suggest).    We're planning on placing some soldermask over the EP as a way to isolate this connection on our prototype boards.

Other than decreased thermal performance, is there anything else we should be concerned with?   We are in essence floating the EP.

How is the EP connected to the die inside the TPS22990?

Don

  • 0
    TI__Genius 10855 points

    Hi Don, 

    Thanks for reaching out on E2E and being patient as many of us are returning from holidays. 

    Unfortunately, the TPS22990 internal FET is designed such that VIN (pin 3) and the thermal pad must both be connected to VIN in order to power different portions of the internal FET. By keeping the thermal pad floating, this prevents the FET from being biased correctly. Is it possible to lay soldermask on the thermal pad, and then etch a copper connection from VIN to the thermal pad? 

    Thanks,

    Arthur Huang

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