TLV62569: Thermal Information

Kelvin Tee

Part Number: TLV62569
Other Parts Discussed in Thread: TPS562200

My customer is evaluating the thermal spec of TLV62569 comparing with TPS562200. TLV62569 has R_ƟJC(TOP)=137.5 and ѰJT31.4 which are relatively higher than TPS562200's 44.5 / 2.2. Is there an explanation why there is large gap between these two devices?

Customer is worrying about the thermal performance of this device. Kindly help to provide a relief on their concern.

Rgds
Kelvin

over 6 years ago

0 Dorian Brillet de Cande over 6 years ago

TI__Genius 14876 points

Hi,

According to its datasheet, TPS562200 uses a DDC package.

Looking at the TLV62569 thermal information for the same package, I see RƟJC(TOP) =52.9°C/W and ѰJT= 11.3°C/W. Those values are quite close to the TPS562200 thermal specification.

Can you check with the customer if this is still a concern?

Thanks and Best Regards,

Dorian Brillet de Candé

0 Kelvin Tee over 6 years ago in reply to Dorian Brillet de Cande

TI__Genius 10035 points

Hi Dorian

Thanks for the clarification. In such case, customer has to consider SOT23-6 DDC instead of SOT23-5 DBV for better thermal performance.
[Currently customer is using TPS56x220 SOT23-6 DDC and they are thinking of moving to TLV62569 for lower cost]

Rgds
Kelvin

Power management

Power management forum

TLV62569: Thermal Information