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UCC21520: FIT rate

Part Number: UCC21520

Hi,

The FIT rate provided for UCC21520 is for Die only or the device package FIT is also included. Also tell what factors are included (Die, Package, EOS.,)

Also please clarify whether the FIT rate provided in the reliability report of TI components is for Die only or any other factors mentioned above are also included.

Thanks,

Suresh.

  • Hello Suresh,

    The FIT rates are summarized by technology and mapped to the associated material part numbers. Therefore, the results from the DPPM/FIT/MTBF estimator: www.ti.com/.../estimator.tsp will apply to the UCC21520 family (automotive + commercial) .

    Take a look at the estimator that I linked and let me know if you have any additional questions.

    If this resolved your question, please press the green resolved button.

    Regards,
    Mateo
  • Hello Mateo,

    Thanks for your feedback. But for relibility calculation and MTTF analysis, can i use this FIT rate or should i include the FIT rate of the IC package also?

    To be precise, is package FIT data included in the IC Technology base Fit rate?

    Regards,

    Suresh.

  • Hello Suresh, 

    I am working on your question and will get back to you soon. I will reach out before the end of the week to update you. 

    regards,
    Mateo

  • Hello Suresh,

    Thank you for being patient. FIT (Failure In Time) is a unit that represents failure rates and how many failures occur every 10 hours. For example, this device has 0.2 failure for every 10 hours.

    The test used to calculate the FIT rate is based off temperature acceleration life time modeling with “finished goods” – Die and Package, all the factors that you mentioned (Die, Package, EOS) are considered.

    If this answered your question please press the green resolved button 

    Regards,
    Mateo