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CSD23203W: How to mount

Part Number: CSD23203W

Hi,

Though my customer is using the  CSD23203W, mount defect is occurring.

The symptom is what BGA ball is shorted  after re-flow.

It didn't improve by reducing mask hole and making mask thick.

This defect doesn't occur on another BGA products.

Has anyone heard this problem?

Could anyone advise me to avoid this problem?

Best Regards,

Kuramochi

  • Kuramochi san,

    Thank you for bringing this question to us to try and help resolve your customers issue.

    I have not heard of this type of issue with our products as long as the customer follows the guidelines in our datasheet for stencil and pcb layout.
    TI also has an application note on our website here: www.ti.com/.../snva009ag.pdf that the customer should follow.

    If all of these guidelines has been followed then I suggest to contact your local TI representative and we can get out SMT experts involved as it is not something we can resolve over this forum.