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LMG1020: LMG1020: What is the package electrically? Is there packaging passivation for this WCSP? (Possibility of touching neighboring components)

Nathan Ellis
Prodigy 20 points
Part Number: LMG1020

Hi there,

I'd like to know what electrical connection the exterior of the WCSP LMG1020 package has: Not the 6 solder balls, but the sides and top of the package. Are they bare exposed P-type substrate? Is there a passivation/electrical isolation coating? Is the active circuitry hidden and protected inside isolation N-wells? I cannot find details in datasheet or other documents provided.

I am wedging this part right next to the GaN FET it is driving (whose exterior packaging is Source) and I want to ensure any touching will be acceptable. 

I know this isn't recommended, particularly for mass production; please humor me ;) 

Thanks for any help!

Nathan

  • 0
    TI__Expert 3355 points
    Hi Nathan,

    Thanks for the good question.

    You're correct, it seems that information isn't in the datasheet. I don't know it off the top of my head either.

    I'll make sure the correct person is assigned to this thread and they will get back to you after the weekend.

    Thanks and best regards,
    John
  • 0 in reply to John Geiger
    TI__Guru**** 189401 points
    Hi Nathan,

    Welcome to e2e, and thanks for your question.

    The top of the LMG1020 has a coating of epoxy on top of it, but the sides are exposed silicon. You need to keep the two devices from touching each other. I know that's a challenge, as you want them as close as possible, but touching may result in undesired operation of the LMG1020.
  • 0 in reply to Don Dapkus
    Prodigy 20 points
    Thank you John and Don, much appreciated!
    The top epoxy is useful info for me in terms of thermal management.
    I would speculate that since the GaN package is 'source' and the driver substrate is likely 'ground' (i.e. it is to be coupled to the FETs source through the PCB anyway), then it may still function correctly (?). But I can appreciate this would require considerable work to investigate and is NOT the parts intended use case.
    Thanks again for the input.
    Nathan