TLV62568: thermal information for different package

Betty Guo

Part Number: TLV62568

Hi,

I have a question about the thermal information in different package, in the below picture:

I wan to know why the DBV thermal resistance is higher than DDC and DRL, but the size of DBV is bigger than DRL, why the size bigger while the thermal resistance is high.

could you help on it? thanks.

over 6 years ago

0 Sabrina over 6 years ago

TI__Expert 8420 points

HI Betty,
Although, DBV is bigger than the DRL, the packaging technology is different. DDC and DRL uses FCOL technology whereas DBV uses wire-bonding technology. FCOL technology helps to achieve better thermal performances.
you can find more detail on these two package technologies in this app note: www.ti.com/.../slva937.pdf

Regards
Sabrina

Power management

Power management forum

TLV62568: thermal information for different package