LM117: DIe at LM117 family

hello Daniel

although the die in package H and K is the same?

Thanks

David

Hey David,

There is a difference in the die due to the current limit.

Thanks,

Daniel

Hi

We are using LM117H MDE

I only have mechanical drawing for this part which I have downloaded from TI website.

Can you please send electrical datasheet dedicated for this p/n?

Thanks

David

Hey David,

LM117H MDE will use the LM117QML-SP datasheet:
www.ti.com/.../lm117qml-sp.pdf

Thanks,
Daniel

Hello Daniel

I am looking on figure 6 on the datasheet you sent, and the information is applicable for only packaged devices.

You said that the die is different from the packaged in the current limit parameter. Please advise which curve it suitable for the die version LM117H MDE

Please explain what the current limit means? it's thermal protection? will it work on the max. current regardless the junction temperature?

Thanks

Hey David,

The die version is LM117H which means it will be equivalent to the H package, except for things that are specific to the package like thermals.

The maximum current limit assumes that the thermals are met and the characteristics of the current limit over temperature are seen in figure 6.

Thanks,

Daniel

Hello Daniel

In datasheet which you pointed me, I did not find parameter “thermal conductance “specified to P/N LM117H MDE (die configuration).
What is the Thermal conductance of LM117H MDE (die configuration)?

Thanks, david.

Hey David,

Are you talking about thermal impedances?

Since the part is die and not in a package there isn't any impedance between the die and the board.

Thanks,

Daniel