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TPS62826: Thermal Information

T Kishi
Genius 4425 points
Part Number: TPS62826
Other Parts Discussed in Thread: STRIKE

Hi

My Customer has question.


Customers are considering adopting the TPS62826.


The TPS62826 data sheet describes two thermal resistances.
Why is the value of θJa significantly different between JEDEC and EVM?

Also, when carrying out evaluation on a JEDEC board, do you have Via etc. on the board?

Regard

T Kishi

  • 0
    TI__Expert 3645 points
    Hello,
    The value given for the EVM fits the application conditions. JEDEC is a standard and if you want you can have a look into this document: www.ti.com/.../spra953c.pdf
  • 0 in reply to Alfonso Furio
    Genius 4425 points
    Hi Alfonso

    Thank you for reply.

    I think that the JEDEC board also has better heat dissipation if it is 2s2p.However Why is EVM better?
    Customers want to know about the factor that θJa differs between JEDEC board and EVM.
    Could you tell me why it is the thickness of the copper foil or how to strike the via?

    Reagrd
    T Kishi
  • 0 in reply to T Kishi
    TI__Expert 3645 points
    Hello,
    As I previously mentioned, JEDEC is a standard, and in the attached document it is briefly shown the process steps for the measurement of RθJa according to the series of documents EIA/JESD51-1,2,5,6,7,9). In our documentation, you saw the thermals parameters referring to this standard (JEDEC) and our EVM. Usually, the JEDEC parameters offer the possibility to adequately compare the thermal performance of different devices because of this common standard of the measure at the packaging level. Looking into the EVM parameters you have an estimation of how to behave a device in a system with a PCB (different layers), passives, and so on...but it is related to our EVM and our layout. If you want a more precise evaluation of the thermal parameters on your board and layout, you need to evaluate them. Our EVM is a four-layer, and the copper foils on our EMVs are 35um tick.