Other Parts Discussed in Thread: TPS22916,
The recommended footprint for the DSBGA package for TPS7A05 component (YKA0004) specifies the Solder Mask Defined pads as preferred, whereas the (for example) DSBGA package for the TPS22916 (YFP0004) specifies Non-Solder Mask Defined as the preferred implementation. These packages are very similar, only the YKA0004 is slightly smaller (0.35 mm ball pitch vs 0.4 mm ball pitch). Why are Solder Mask Defined pads recommended for the YKA0004? I would prefer to use Non-Solder Mask Defined pads, but I hesitate to disregard the preferences listed in the data sheet.
