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LMG1020: placing lmg1020

Part Number: LMG1020

could you please suggest , how can i place lmg1020 in board...

i have a bga proto place machine but minimum size of bga component which can be placed is 5*5(mm) only...

  • Hi Hitesh,

    thanks for posting on e2e,
    LMG1020 is so small that the pick and place technology needs to be state-of-the-art to pick it up and place it. Eyeball alignment is possible but its difficult to achieve consistent placement accuracy. It is possible to place LMG1020 by hand if only needing to solder a few for test purposes. For production purposes, without a pick and place machine capable of 1x1mm, I will have to reach out to my team to see if they have any other solutions. Let me update you on this thread by the end of the week.

    thanks,
  • Hi Hitesh,

    After asking my team SMT, with out the proper pick and place machine the best way to solder the part is to place it by hand. Typically we pre-heat under the board and use a hot air gun on low airflow focused at the part on the top. Use solder paste and flux so that during reflow the part will self align and make solid connections on all 6 balls. Please let me know if this helps to answer your question or you have any more questions.

    thanks,

  • I have a re-flow oven , is it good to use that...if yes then could you suggest an re-flow temperature curve...
    Please guide me for selection of solder paste for lmg1020 re-flow process: solder paste type(3/4/or 5...?) and melting point...
  • Hi Hitesh,

    Check out the app note below on what reflow profile temperature and liquidus or melting point to use.
    For example) use type 3 or finer solder paste like, SAC305 Type 4 and stay under 260C peak profile for WCSP.
    www.ti.com/.../scet007b.pdf

    thanks,