LMG1205: Coefficient of Thermal Expansion (CTE) for Several Parts

David Weisenberg

Intellectual 510 points

Part Number: LMG1205

Hi! I am doing a thermal cycle durability analysis for an assembly that uses a LOT of T.I. parts.

Can you please tell me the coefficient of thermal expansion (CTE) for the following power management parts:

LMG1205YFXR

LM4040C25MDBZTEP

TPS3813K33MDBVREP

TPS3808G01MDBVTEP

UCC2808AQDR-2EP

ISO5852SMDWREP

UCC2808AQDR-2EP

(I apologize for the quantity of parts!)

Thanks in advance for your help!

over 6 years ago

0 Jeffrey Mueller over 6 years ago

TI__Genius 12990 points

Hi David,

thanks for your question on LMG1205,
Im part of the high voltage gate driver team supporting LMG1205. I should be able to get some info on this from the packaging team.
Let me update you, at least with LMG1205 CTE, by the end of the week on this thread.

thanks,

0 David Weisenberg over 6 years ago in reply to Jeffrey Mueller

Intellectual 510 points

Great! Thanks!

Will you also be able to get this info for the other 6 parts I listed?

0 Wade Vonbergen over 6 years ago in reply to David Weisenberg

TI__Guru 62930 points

David,
All of the CTE's for the plastic encapsulated devices will have the same result as noted in this e2e post: e2e.ti.com/.../789140

The CTE of mold compounds is considered NDA and will take more effort to provide if necessary. For BLR and solder studies, I would expect that the mold compound has minimal to no influence compared to the leadframe.

Regards,
Wade

0 David Weisenberg over 6 years ago in reply to Wade Vonbergen

Intellectual 510 points

Thanks for your help with this!

Power management

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LMG1205: Coefficient of Thermal Expansion (CTE) for Several Parts