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TLV62585: thermal questions

user021864
Intellectual 2145 points
Part Number: TLV62585

Hi , 

May I ask that why the junction to ambient of QFN is better than SOT, but the other parameter of SOT is higher than QFN package? 

Thanks for your help.

  • 0
    TI__Mastermind 37471 points
    Dear Customer,

    QFN package relies on its 12 pins to transfer the heat to the air hence it has lower Rth(j-a) versus DRL package (6-pin).

    On the other hand, DRL package has thinner mold compound (non-conductive protective material of the IC) compared to QFN package making its Rth(j-c) & Junction-to-top characterization parameter lower. As a rule of thumb, the higher the package height the thicker the mold compound.


    Best regards,
    Excel