Other Parts Discussed in Thread: TPS25982
Can you please clarify the electrical connectivity of the two PPAD thermal pads on the TPS24751? I get from the datasheet instructions that we should connect the larger pad to the fet drain plane, and perhaps ground to the smaller of the two thermal pads. But the eval module shows both pads connected to ground planes. Does this mean you have a good thermal connection to the die through a thin oxide or other passivation layer, but no electrical connection, so we can use any pcb plane we want for connecting to either pad, as long as we provide a nice thermal path? Is that also the case for the area between the pads, so we can safely have a single plane underneath the entire center of the chip?
Thanks.