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UCC28061-Q1: Influence of mold compound and die-attach for EMI

Kuramochi Tadahiko
Guru 28715 points
Part Number: UCC28061-Q1

Hi,

The PCN is announced for the UCC28061-Q1.

The content is changing mold compound and die-attach.

Is this PCN affected for EMI characteristics?

Best Regards,

Kuramochi