UCC28061-Q1: Influence of mold compound and die-attach for EMI

Kuramochi Tadahiko

Guru 28715 points

Part Number: UCC28061-Q1

Hi,

The PCN is announced for the UCC28061-Q1.

The content is changing mold compound and die-attach.

Is this PCN affected for EMI characteristics?

Best Regards,

Kuramochi

0 Benjamin Lough over 6 years ago

Hi TQ,

Thanks for reaching out. I would not expect the mold compound or die attach to change EMI characteristics.

Best Regards,
Ben Lough

Power management forum