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TPSM84624: Are vias-in-pad required in the footprint?

Lisa Silver
Prodigy 10 points
Part Number: TPSM84624


Hi,

I'm considering using the TPSM84624 in a low cost board. However, I've noticed the landing pattern suggests using vias in pad, which spikes up the price of the PCB.

Are the vias in question required?

BTW, the landing pattern is shows in page 32 in the datasheet.

Best regards,

Lisa Silver

  • 0
    TI__Mastermind 28020 points

    Hi Lisa,

    Note 5 of the attached drawing states that the vias are optional. The vias are added to draw heat from the device into internal copper layers of the PCB. If no vias are added and you rely only on the top layer copper to dissipate heat, the device may run slightly warmer. Depending on your application this may not affect you, especially if you are not running near the safe operating area thermal limits of the device.

    Thanks, Jason