Other Parts Discussed in Thread: UCC24612
We have a new issue about our finalized design with UCC28780 and UCC24612. We had designed in LMG3410 in it but our very dense packaging caused us to look into it harder.
Then we come across TIDA-01622: it proposes GaN for high side switch for the active energy recovery & ZVS scheme and for the lower switch. The parts are from Navitas.
We found the parts mentioned in TIDA-01622 to be more suitable for high-density packaging.
BUT: Navitas does not intend to provide any design support to us at all!
Nada. Zilch. They have other lofty intentions.
So many questions here: do we follow TIDA-01622 approach when the GaN switch provider does not seem to be committed to this market?
If they pull off the NV6117 devices from the market, do we have equivalents from others? How reliable are these devices according to TI's findings and how dependable will the supply be?
Does TI have plans to make LMG3410 more integrated so that lot of glue parts will not be necessary? Such as a very high value of capacitors, large inductor, etc? So that if Navitas dropped these devices, we can switch back to LMG3410 within the same footprint & glue parts.
We are about to go to fab the pcbs this week.
So the question is very relevant: it is too late to go back to LMG3410 as we speak, but we would appreciate some thoughts from you all on this.
-r
