Hi friends
I would like to design the footprint for TLC5958. I have a doubt whether i need to design the thermal pad with vias mentioned in datasheet orelse only the thermal pad alone is ok.
Kindly clarify it
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Hi friends
I would like to design the footprint for TLC5958. I have a doubt whether i need to design the thermal pad with vias mentioned in datasheet orelse only the thermal pad alone is ok.
Kindly clarify it
Proper engineer has been assigned to take a look at this and will reply you soon.
Hi,
We strongly recommend to design the thermal pad with vias and also connect the thermal pad with the GND pin of the device.
Regards,
Shawn.