Dear Specialists,
My customer is considering TLV755P and has a question.
I would be grateful if you could advise.
---
According to the datasheet P.4 6.4 Thermal Information,
RθJA of DRV(SON) package is 100.2°C/W and RθJC(top) is 108.5 °C/W.
I think Theta(j-a) is quite small and Theta(j-c) is too large.
Because Theta(j-a) is thermal resistance from junction to Ambient.
On the other hand RθJC(top) is junction to case(top), this is shorter.
Could you please let me know why.
Is the measurement method different?
---
I appreciate your great help.
Best regards,
Shinichi