LM5085: Questions regarding footprint design and the pasting design

Harold Nelson

Part Number: LM5085

My customer has the following question, below, and thinks there may be an error in the documentation?

There is a potential typo in the data sheet in section 10.1, and I need clarification. Preferably, I need to speak to someone concerning the footprint design and the pasting design.

over 6 years ago

0 Harold Nelson over 6 years ago

Prodigy 100 points

The third paragraph of 10.1 on page-23 lists two packages with exposed pads ‘(HVSSOP-8 or WSON-8)’ which are supposed to be used with higher power applications:

WSON-8 is the ‘NGQ’ Package Drawing – it has a pad and this is correct
HVSSOP-8 does not exist. The closest is VSSOP-8 and it is the ‘DGK’ drawing and it does not show a pad

The mistake is listing the HVSSOP-8 instead of the MSOPPowerPAD which is the DGN Package Drawing and it has a pad.

I need this confirmed.7536.lm5085.pdf

0 Frank De Stasi over 6 years ago in reply to Harold Nelson

TI__Guru 71985 points

I will pass this to the product engineer who can better answer you question.

0 Harold Nelson over 6 years ago in reply to Frank De Stasi

Prodigy 100 points

Hello,

Is there an update to this question as my customer is very anxious to either get a firm resolution or speak with someone at TI?

Thanks,

Harold

0 Frank De Stasi over 6 years ago in reply to Harold Nelson

TI__Guru 71985 points

It is unfortunate that the nomenclature is unclear.

However, the "MSOP Power Pad" is the same as the "HVSSOP"

You are correct.

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LM5085: Questions regarding footprint design and the pasting design