TPS82140: Any soldering, assembly requirement for TPS82140?

Antonio Faggio

Part Number: TPS82140

Hi All,

My customer is using TPS82140SILR.

Are you aware of any special assembly instructions or any PCNs on this matter, which customer is not aware of regarding TPS82140SIRL p/n?

Customer had problems with temperatures for the welding.

Many Thanks,

Antonio

over 6 years ago

0 Omar Hegazi over 6 years ago

TI__Intellectual 1780 points

Hi Antonio,

Please refer to the application note "MicroSiP™ Design Guide" listed in the user guides section for the product.

Best regards,

Omar

0 Antonio Faggio over 6 years ago in reply to Omar Hegazi

TI__Expert 7920 points

Hi All,

The AppNote refers to a BGA package, while that of the TPS82140 is a μSiL-8 (SIL0008C) ... there are special requirements for this specific package, or a standard and controlled process for WSON / LGA Rohs avoids any kind of problem ?

Many Thanks,

Antonio

0 Omar Hegazi over 6 years ago in reply to Antonio Faggio

TI__Intellectual 1780 points

Hi Antonio,

BGA refers to Ball Grid Array, which is used in the μSiL package that is used in the TPS82140. The app note discusses the package from all perspectives and the assembly of the MicroSiP package can be treated exactly like a BGA. What exactly is the issue your customer is facing?

Regards,

Omar

0 Omar Hegazi over 6 years ago in reply to Omar Hegazi

TI__Intellectual 1780 points

Hi Antonio,

Does your customer still have the issues?

Regards,

Omar

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TPS82140: Any soldering, assembly requirement for TPS82140?