Hello,
I was wondering if I can have a private check of my design we had issues with the previous iterations with having the charging system running in a warm environment (e.g 30 degrees Celsius),
The first one was only able to handle it for a short period and the charger completely failed, but this we identified due to the board rework we did to the mosfets which caused them to get hot too quickly.
Next version we found that the copper provided to the BQ24610 thermal PAD was too small causing charging to fail after a few minutes.
I hope if you would be able to look at the new design, I reviewed the power point Wang Li provided and carefully reviewed the PCB layout recommendation on the datasheet, but I would hope to get a TI engineers expert opinion.
We have other TI parts which is the LMZM33606RLX, which we also would like opinions if the layout is good this time, this would be very helpful as then we don't make any more mistakes.
Please let me know soon as possible as we need to progress to prototyping again this board soon.
Best regards
Mohammed Al-Amin
